***********************************************************************
***********           PANJIT International Inc.             ***********
***********************************************************************
*Apr 12, 2019                                                         *
*                                                                     *
*This SPICE Model describes the characteristics of a typical device   *
*and does not respresent the specification. Designer should refer to  *
*the same type name data sheet for specification limits.              *
***********************************************************************
*$
.subckt BC817DPN-AU EP BP CN EN EB CP
qn CN BN EN nbjt
qp CP BP EP pbjt
.model bjt pnp
*****DC curve parameter***
+  is = 5.189e-12	  nf = 1.200		  nr = 1.207
+ ikf = 7.246e-1	 ikr = 3.518e-2		 vaf = 13.91
+ ise = 5.672e-14	  ne = 1.560		 isc = 1.548e-13		  nc = 3.2264
+  bf = 182.9		  br = 5.311		  nk = 6.552e-1
+  rb = 1.8735		  rc = 3.241e-1
*****capacitance parameter***
+ cje = 1.632e-11	 vje = 7.595e-1		 mje = 3.599e-1
+ cjc = 4.623e-12	 vjc = 4.535e-1		 mjc = 3.734e-1
*****thermal parameter***
+ xtb = 1.00		  eg = 9.408e-1
+trb1 = 3.743e-3	trc1 = 1e-3
.model bjt npn
*****DC curve parameter***
+  is = 5.189e-12	  nf = 1.200		  nr = 1.257
+ ikf = 9.246e-1	 ikr = 3.518e-2		 vaf = 13.91
+ ise = 5.672e-14	  ne = 1.560		 isc = 1.548e-13		  nc = 3.5264
+  bf = 273.4		  br = 5.311		  nk = 7.267e-1
+  rb = 1.901		  rc = 3.241e-1
*****capacitance parameter***
+ cje = 1.632e-11	 vje = 7.595e-1		 mje = 3.599e-1
+ cjc = 4.623e-12	 vjc = 4.535e-1		 mjc = 3.734e-1
*****thermal parameter***
+ xtb = 1.00		  eg = 9.608e-1
+trb1 = 1.543e-2	trc1 = 1e-3
.ends
*$
